The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis

Microelectronics Reliability

Volumn 46, Issue 9-11, 2006, Pages 1874-1879

  Yew, M C ^a   Chou, C Y ^a   Huang, C S ^b   Yang, W K ^b   Chiang, K N ^a  

^a Advanced Microsystem Packaging and Nano Mechanics Research Lab   (Taiwan)

^b Advanced Chip Engineering Technology Inc   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DEFORMATION; FINITE ELEMENT METHOD; MICROPROCESSOR CHIPS; NETWORKS (CIRCUITS); THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION (CTE); SOLDER ON RUBBER (SOR); WAFER LEVEL CHIP SCALE PACKAGE (WLCSP);

LARGE SCALE SYSTEMS;

EID: 33748204585     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.07.084     Document Type: Article

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