Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 523-534

  Peng, Chih Tang ^a   Kuo, Chia Tai ^b   Chiang, Kuo Ning ^c   Ku, Terry ^d   Chang, Kenny ^d  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^d VIA Technology Corporation ^*  (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; FLIP CHIP DEVICES; LEAD; MECHANICAL PROPERTIES; METALLURGY; RELIABILITY; SCANNING ELECTRON MICROSCOPY;

BUMPING PROCESS; COPPER CHIP; FLIP CHIP BONDING TECHNOLOGY; UNDER BUMP METALLURGY (UBM);

INTERMETALLICS;

EID: 30844433077     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.06.010     Document Type: Article

References (13)

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