Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sizes

Metals and Materials International

Volumn 9, Issue 3, 2003, Pages 273-278

  Choi, Jin Won ^a   Cha, Ho Seob ^a   Oh, Tae Sung ^a  

^a Hong Ik University   (South Korea)

Author keywords

Aging; Electronic packaging; Shear strength; Sn Pb; Solder

Indexed keywords

AGING OF MATERIALS; BINARY ALLOYS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; LEAD ALLOYS; NICKEL; SHEAR STRENGTH; TIN ALLOYS;

63SN37PB; AGING CHARACTERISTICS; AGING TREATMENT; CRACK SIZES; ELECTRONIC PACKAGING; PAD SIZES; SOLDER BALLS; SOLDER BUMP;

SOLDERING;

EID: 1842420405     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03027046     Document Type: Article

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