Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering

Journal of Electronic Materials

Volumn 29, Issue 10, 2000, Pages 1153-1159

  Lee, Jong Hyun ^a   Park, Daejin ^a   Moon, Jong Tae ^b   Lee, Yong Ho ^a   Shin, Dong Hyuk ^c   Kim, Yong Seog ^a  

^a Hong Ik University   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

^c Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DISSOLUTION; EUTECTICS; INTERFACIAL ENERGY; LASER ABLATION; METALLOGRAPHIC MICROSTRUCTURE; SHEAR STRENGTH; SOLDERING; TIN ALLOYS;

SOLDER BUMPS; TIN LEAD ALLOYS;

SOLDERING ALLOYS;

EID: 0034298171     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0006-7     Document Type: Article

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