The correlation between stress relaxation and steady-state creep of eutectic Sn-Pb

Journal of Electronic Materials

Volumn 34, Issue 10, 2005, Pages 1287-1300

  Bang, W H ^a,c,d   Oh, K H ^a   Jung, J P ^b   Morris Jr , J W ^c,d   Hua, Fay ^e  

^a Seoul National University   (South Korea)

^b University of Seoul   (South Korea)

^c University of California Berkeley   (United States)

^d LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^e INTEL CORPORATION   (United States)

Author keywords

Eutectic Sn Pb solder; Steady state creep; Stress relaxation

Indexed keywords

CREEP; DATA ACQUISITION; DIFFUSION; GRAIN BOUNDARIES; RAPID SOLIDIFICATION; RECRYSTALLIZATION (METALLURGY); TIN ALLOYS;

BOUNDARY DIFFUSION; GRAIN BOUNDARY CREEP; SOLDER MATERIAL; STEADY-STATE CREEP;

STRESS RELAXATION;

EID: 27144537802     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0252-9     Document Type: Review

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