Flare evaluation of ASML alpha demo tool

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7271, Issue , 2009, Pages

  Mizuno, Hiroyuki ^a   McIntyre, Gregory ^b   Koay, Chiew Seng ^b   Burkhardt, Martin ^b   La Fontaine, Bruno ^c   Wood, Obert ^d  

^a Toshiba America Inc   (United States)

^b IBM RESEARCH   (United States)

^c One AMD Place   (United States)

^d State University of New York   (United States)

Author keywords

Alpha Demo Tool (ADT); Donut; EUV; Flare; Grating donut; Out of Band (OoB) radiation; REMA (reticle masking)

Indexed keywords

ALPHA DEMO TOOL (ADT); DONUT; EUV; FLARE; GRATING DONUT; OUT-OF-BAND (OOB) RADIATION; REMA (RETICLE MASKING);

LIGHT; MIRRORS; OPTICAL INSTRUMENTS; OPTICAL TRANSFER FUNCTION; PHOTORESISTS; POWER SPECTRAL DENSITY; SURFACE CHEMISTRY; SURFACE PROPERTIES; SURFACE ROUGHNESS;

ULTRAVIOLET DEVICES;

EID: 67149101478     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.814312     Document Type: Conference Paper

References (5)

1. H. Aoyama, Y. Tanaka, T. Kamo, N. Iriki, Y. Arisawa and T. Tanaka, "Flare evaluation for 32-nm half pitch using SFET", Proc. SPIE, Vol. 6921, 69213H (2009).
2. H. Meiling, et al., "Performance of the Full Field EUV Systems", Proc. SPIE, Vol. 6921, 69210L (2009).
3. H. Mizuno, et al., "Flare evaluation of an ASML Alpha Demo Tool", EUVL Symposium (2008)
4. T. Miura, et al., "Nikon EUVL development progress update", Proc. SPIE, Vol. 6921, 69210M (2009)
5. O. Wood, et al., "Integration of EUV lithography in the fabrication of 22-nm node devices", SPIE (2009) (in printing)