Transient stress distributions in NCF-Bonded COG packages due to moisture diffusion

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 3, 2008, Pages 454-462

  Tsai, M Y ^a   Wu, C Y ^a   Huang, C Y ^a   Yang, S S ^b  

^a CHANG GUNG UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Adhesive; Chip on glass (COG); Diffusion; Electronic packaging; Moisture; Nonconductive film (NCF); Stress

Indexed keywords

ANISOTROPIC CONDUCTIVE FILMS; BI MATERIALS; CHIP-ON-GLASS (COG); DIFFUSION THEORIES; ELECTRONIC PACKAGING; FINITE ELEMENT MODELS; FINITE-ELEMENT ANALYSIS; GOLD BUMPS; INDUCED STRAINS; INNOVATIVE APPROACHES; INTERFACIAL DELAMINATIONS; INTERFACIAL STRESS; MOISTURE ABSORPTIONS; MOISTURE DIFFUSION COEFFICIENTS; MOISTURE DIFFUSIONS; MOISTURE SATURATIONS; NONCONDUCTIVE FILM (NCF); NUMERICAL APPROACHES; OUT OF PLANES; PARAMETRIC STUDIES; SECTION MODELS; STRESS FIELDS; STRESS STATE; TRANSIENT FINITE ELEMENT ANALYSIS; TRANSIENT STRESS; TWYMAN-GREEN INTERFEROMETRIES;

ABSORPTION; CHIP SCALE PACKAGES; CONDUCTIVE FILMS; DIFFUSION; FINITE ELEMENT METHOD; GLASS; LIGHT SOURCES; LIQUID CRYSTAL DISPLAYS; LIQUID CRYSTALS; POLYIMIDES; POLYMERS; STRAIN; STRESS CONCENTRATION; TENSILE STRESS;

MOISTURE;

EID: 65349175280     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.927844     Document Type: Article

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