Analytical and numerical bound analysis of hygroscopic swelling characterization

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 734-739

  Zhou, Jiang ^a  

^a Lamar University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; ELASTICITY; NUMERICAL METHODS; STRAIN MEASUREMENT; THERMOGRAVIMETRIC ANALYSIS;

HYGROSCOPIC STRESSES; HYGROSCOPIC SWELLING; MOISTURE DIFFUSION; MOISTURE DISTRIBUTION;

MOISTURE DETERMINATION;

EID: 33845576636     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645739     Document Type: Conference Paper

References (8)

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2. Tee, T. Y., Kho, C. I., Yap, D., Toh, C., Baraton, X., Zhong, Z., "Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill" Microelectronics Reliablity, 2003, pp. 741-749.
3. Stellrecht, E., Han, B., Pecht, M. G., "Characterization of Hygroscopic swelling behavior of mold compounds and plastic packages," IEEE transactions on Components and Packing Technologies, 2004, pp. 499-506.
4. Zhou, J., "Investigation of inner-layer dielectric (ILD) failure by hygroscopic swelling," IEEE 55th Electronic Comp. and Technology Conference, 2005, pp. 1254-1260,
5. Zhou, J., "Investigation of Non-Uniform Moisture Distribution on Determination of Hygroscopic Swelling Coefficient and Finite Element Modeling for a Flip Chip Package," IEEE International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, pp. 118-126
6. th International Symposium on Microelectronics, 2005, pp 673-680
7. Zhou, J., Tee, T. Y., and X. Zhang, "Transient analysis on hygroscopic swelling characterization using sequentially coupled moisture diffusion and hygroscopic stress modeling approach," Proceedings of ASME International Mechanical Engineering Congress and Rd & D Expo, 2005. IMECE 2005-81847
8. Zhou, J., "Sequentially-coupled finite element transient analysis," IEEE International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-System, 2006.