Hygrothermal effect on deformations of QFN electronic packaging

Journal of Mechanics

Volumn 22, Issue 4, 2006, Pages 271-280

  Tsai, M Y ^a   Huang, C H ^a   Huang, C Y ^a  

^a CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

Deformation; Electronic packaging; EMC; Hygrothermal effect; Moir interferometry; Moisture; QFN; Thermal; Twyman green interferometry

Indexed keywords

DEFORMATION; EPOXY RESINS; INTERFEROMETRY; MOISTURE; REAL TIME SYSTEMS; SHEET MOLDING COMPOUNDS; THERMAL EFFECTS;

HYGROTHERMAL EFFECT; QUAD FLAT NON-LEAD (QFN); TWYMAN-GREEN INTERFEROMETRY;

ELECTRONICS PACKAGING;

EID: 33846233725     PISSN: 17277191     EISSN: None     Source Type: Journal    
DOI: 10.1017/s1727719100000927     Document Type: Article

References (13)

1. Suhir, E., "Effect of Plastic Package Geometry on Its Propensity to Moisture Induced Failure," Electronic Packaging for High Reliability, Low Cost Electronics, Tummala, R., Ed., Kluwer Academic Publishers, pp. 25-51 (1999).
2. Wong, E. H., Chan, K. C., Rajoo, R. and Lim, T. B., "The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging," Electronic Components and Technology Conference, pp. 576-580 (2000).
3. Yi, S., Goh, J. S. and Yang, J. C., "Residual Stress in Plastic IC Packages During Surface Mounting Process Preceded by Moisture Soaking Test," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 20(3), pp. 247-255 (1997).
4. Pecht, M. G. and Govind, A., "In-Situ Measurements of Surface Mount IC Package Deformations During Reflow Soldering," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C, 20(3), pp. 207-212 (1997).
5. Uschitsky, M. and Suhir, E., "Moisture Diffusion in Epoxy Molding Compounds Filled with Particles," Journal of Electronic Packaging, 123, pp. 47-51 (2001).
6. Fremont, H., Deletage, J. Y., Pintus A. and Danto, Y., "Evaluation of the Moisture Sensitivity of Molding Compounds of IC's Packages," Journal of Electronic Packaging, 123, pp. 16-18 (2001).
7. Post, D., Man, B. and Ifju, P., High Sensitivity Moiré Experimental Analysis for Mechanics and Materials, Springer-Verlag, NY (1993).
8. Kobayashi, A. S., Handbook on Experimental Mechanics, Society for Experimental Mechanics, Inc. (1993).
9. Huang, C. H., "Moisture-Induced Deformations and Stresses in Plastic IC Packages," Master Thesis, Chang Gung University, Taiwan (2001).
10. Tsai, M. Y., Hsu, C. H. and Wang, C. T., "Investigation of Thermo-Mechanical Behaviors of Flip Chip BGA in IC Packaging," IEEE Transactions on Components and Packaging Technologies, 27(3), pp. 568-576 (2004)
11. Huang, S. J., and Lin, H. L., "Electronic Speckle Pattern Interferometry Applied to the Displacement Measurement of Sandwich Plates with Single Fully-Potted Insert," Journal of Mechanics, 20, pp. 273-276 (2004).
12. Tsai, M. Y., Chiang, W. C., Liu, T. M. and Hsu, G. H., "Thermal Deformation Measurements and Predictions of MAP-BGA Electronic Packages," Microelectronic Reliability, 46(2-4), pp. 476-486 (2006).
13. Pan, T. Y., and Pao, Y. H., "Deformation in Multi-Layer Stacked Assemblies," J. of Electronic Packaging, 112, pp. 30-34 (1990).