Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 206-214

  Ardebili, Haleh ^a   Wong, Ee Hua ^b   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Hygroscopic; Hygroscopic mismatch strain; Moisture diffusion; Plastic encapsulated microelectronics; Swelling; Thermal strain

Indexed keywords

DESORPTION; DIFFUSION; ENCAPSULATION; EPOXY RESINS; MOISTURE; RELIABILITY; SHEET MOLDING COMPOUNDS; SWELLING; THERMAL EXPANSION;

HYGROSCOPIC MISMATCH STRAIN; MOISTURE DIFFUSION; THERMAL STRAIN;

ELECTRONICS PACKAGING;

EID: 0038481213     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.806172     Document Type: Article

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