Moisture diffusion and heat transfer in plastic IC packages

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 2, 1996, Pages 186-193

  Tay, Andrew A O ^a,b   Lin, Tingyu ^b  

^a IEEE

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Finite element simulation; Heat transfer; Moisture; Plastic IC packages

Indexed keywords

COMPUTER SIMULATION; DIFFUSION; FINITE ELEMENT METHOD; HEAT TRANSFER; INTEGRATED CIRCUIT MANUFACTURE; MOISTURE; PLASTIC PRODUCTS; SOLDERING;

MOISTURE DIFFUSION; PLASTIC INTEGRATED CIRCUIT PACKAGES; TRANSIENT BUILD UP; TWO DIMENSIONAL ANALYSIS; VAPOR PHASE REFLOW SOLDERING;

ELECTRONICS PACKAGING;

EID: 0030168482     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.506103     Document Type: Article

References (12)

1. I. Fukuzawa, S. Ishiguro, and S. Nanbu, "Moisture resistance degradation of plastic LSI's by reflow soldering," in Proc. IRPS, 1985, pp. 192-197.
2. M. Kitano, A. Nishimura, and S. Kawai, "Analysis of package cracking during reflow soldering process," in Proc. IRPS, 1988, pp. 90-95.
3. M. G. McMaster and D. S. Soane, "Water sorption in epoxy thin films," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 12, no. 3, pp. 373-385, 1989.
4. I. Anjoh, K. Nishi, M. Kitano, and T. Yoshida, "Analysis of the package cracking problem with vapor phase reflow soldering and corrective action," Brazing Soldering, pp. 48-51, 1988.
5. U. Miura, "Temperature distribution in IC plastic packages in the reflow soldering process," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 4, pp. 499-505, 1988.
6. R. Lin, E. Blackshear, and P. Serisky, "Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process," in Proc. IRPS, 1988, pp. 83-89.
7. M. Tanaka and K. Nishi, "A novel test method of resistance to soldering heat of plastic encapsulated surface mount LSI's," tech. rep., Hitachi Ltd., 1990.
8. S. Ito, "Development of epoxy encapsulants for surface mounted devices," Nitto Tech. Rep., pp. 78-82, 1987.
9. P. C. Liu and D. W. Wang, "Moisture absorption behavior of printed circuit laminate materials," Adv. Electron. Packag., vol. 4, no. 1, pp. 435-442, 1993.
10. L. L. Marsh, R. Lasky, D. P. Seraphim, and G. S. Springer, "Moisture solubility and diffusion in epoxy and epoxy-glass composite," IBM J. Res. Dev., vol. 28, pp. 655-661, 1984.
11. J. E. Ritter and K. Conley, "Moisture-assisted crack propagation at polymer/glass interfaces," Int. J. Adhesion Adhesives, vol. 12, pp. 245-250, 1992.
12. Hibbitt Karlsson & Sorensen, Inc., ABAQUS User's Manual, version 5.4, 1994.