Study of some parameter effects on warpage and bump-joint stresses of COG packages

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 3, 2006, Pages 587-598

  Tsai, Ming Yi ^a   Wu, Chung Yen ^a   Huang, Chen Yu ^a   Cheng, Wen Chen ^b,c   Yang, Sheng Shu ^b  

^a CHANG GUNG UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c Taiwan TFT LCD Association   (Taiwan)

Author keywords

Adhesive; Anisotropic conductive adhesive; Bump joint stress; Chip on glass (COG); Finite element model (FEM); Twyman Green interferometry; Warpage

Indexed keywords

ADHESIVES; CONDUCTIVE MATERIALS; ELASTIC MODULI; FINITE ELEMENT METHOD; MOISTURE; TENSILE STRESS; THERMAL EXPANSION; THERMAL LOAD;

ANISOTROPIC CONDUCTIVE ADHESIVE; BUMP-JOINT STRESS; CHIP-ON-GLASS; TWYMAN-GREEN INTERFEROMETRY; WARPAGE;

CHIP SCALE PACKAGES;

EID: 33747593079     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.875094     Document Type: Article

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