Predicting technique of delamination at adhesively bonding joints in an flip chip package during solder reflow process

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1167-1175

  Ikeda, Toru ^a   Kim, Won Keun ^b   Miyazaki, Noriyuki ^a  

^a KYOTO UNIVERSITY   (Japan)

^b KYUSHU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVELY BONDING TECHNIQUES; ANISOTROPIC CONDUCTIVE FILM (ACF); VAPOR PRESSURES;

ADHESIVE JOINTS; BONDING; DELAMINATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE; STRESS INTENSITY FACTORS;

SOLDERED JOINTS;

EID: 32844454308     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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