Characterization of hygroscopic swelling behavior of mold compounds and plastic packages

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 3, 2004, Pages 499-506

  Stellrecht, Eric ^a   Han, Bongtae ^b   Pecht, Michael G ^b  

^a Mechanical Engineering Department   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFEROMETRY; MOIRE FRINGES; MOISTURE; PLASTIC PRODUCTS; RELIABILITY; SHEET MOLDING COMPOUNDS; SWELLING; THERMAL EXPANSION;

CHIP COMPOUND INTERFACE; HYGROSCOPIC SWELLING BEHAVIOR; MOIRE INTERFEROMETRY; MOLD COMPOUND INTERFACE; PLASTIC ENCAPSULATED MICROCIRCUIT;

CHIP SCALE PACKAGES;

EID: 4444259740     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.831777     Document Type: Article

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