Sub-100nm pattern transfer on compound semiconductor using sol-gel based TiO 2 resist

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7205, Issue , 2009, Pages

  Liu, Boyang ^a   Ho, Seng Tiong ^a  

^a Northwestern University   (United States)

Author keywords

Dry etching; Nano patterning; Resist; Sol gel; Titanium oxide

Indexed keywords

COMPOUND SEMICONDUCTORS; E-BEAM LITHOGRAPHIES; ETCHING PATTERNS; ETCHING SELECTIVITIES; HIGH ASPECT RATIO ETCHINGS; III-V COMPOUND SEMICONDUCTORS; INP; NANO-METER SCALE; NANO-PATTERNING; NEW APPROACHES; OPTO-ELECTRONIC APPLICATIONS; OPTOELECTRONIC SYSTEMS; PATTERN TRANSFERS; PATTERNING PROCESS; PLASMA DRY ETCHINGS; RESIST; SUB MICROMETERS; SUB-100 NM; TEMPERATURE DEPENDENCES; THERMAL STABILITY STUDIES; TRANSFER PATTERNS; ULTRA SMALLS;

ASPECT RATIO; CURING; ELECTRIC CONDUCTIVITY; GELATION; GELS; OPTOELECTRONIC DEVICES; PHOTORESISTS; PLASMA ETCHING; PRESSURE DROP; SEMICONDUCTOR MATERIALS; SILICON COMPOUNDS; SOL-GEL PROCESS; SOL-GELS; SOLS; THICKNESS MEASUREMENT; TITANIUM; TITANIUM OXIDES;

DRY ETCHING;

EID: 65349101802     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.808647     Document Type: Conference Paper

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