Electromigration-induced Bi segregation in eutectic SnBi solder joint

Journal of Electronic Materials

Volumn 36, Issue 2, 2007, Pages 168-172

  Chen, Chih Ming ^a   Chen, Long Tai ^a   Lin, Ya Shiu ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Electromigration; Segregation; Solder

Indexed keywords

CURRENT STRESSING; INTERPHASE BOUNDARY;

CURRENT DENSITY; ELECTRIC CONDUCTIVITY; ELECTROMIGRATION; EUTECTICS; SOLDERED JOINTS; SURFACE SEGREGATION; TIN ALLOYS;

BISMUTH;

EID: 33947610306     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0025-0     Document Type: Article

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