Effect of aging on the microstructure and shear strength of SnPbAg/Ni-P/Cu and SnAg/Ni-P/Cu solder joints

Journal of Electronic Materials

Volumn 29, Issue 9, 2000, Pages 1105-1109

  Ahat, Shawkret ^a   Du, Liguang ^a   Sheng, Mei ^a   Luo, Le ^a   Kempe, Wolfgang ^b   Freytag, Juergen ^b  

^a DaimlerChrysler SIM Technology Co Ltd   (China)

^b DAIMLER AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COPPER; INTERFACES (MATERIALS); METALLOGRAPHIC MICROSTRUCTURE; NICKEL ALLOYS; SHEAR STRENGTH; TIN ALLOYS;

NICKEL PHOSPHIDE; NICKEL TIN ALLOY; TIN LEAD SILVER ALLOY; TIN SILVER ALLOY;

SOLDERED JOINTS;

EID: 0034273725     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0272-x     Document Type: Article

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