TEM observation of solder joints of an electronic device

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 64, Issue 3, 2000, Pages 213-217

  Matsuki, Hirohisa ^a   Ibuka, Hiroshi ^a   Saka, Hiroyasu ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLESS PLATING; EUTECTICS; GOLD PLATING; INTERFACES (MATERIALS); INTERMETALLICS; ION BEAMS; NICKEL ALLOYS; NICKEL PLATING; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICES; SOLDERING ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

NICKEL PHOSPHIDE;

SOLDERED JOINTS;

EID: 0033707034     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet1952.64.3_213     Document Type: Article

References (12)