Fast thermal models for power device packaging

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)

Volumn , Issue , 2008, Pages

  Swan, I R ^a   Bryant, A T ^a   Mawby, P A ^a  

^a UNIVERSITY OF WARWICK   (United Kingdom)

Author keywords

FLOTHERM; Fourier series; IGBT; Modules; Packaging; Thermal models

Indexed keywords

ACTIVE FILTERS; ELECTRIC EQUIPMENT; FOURIER ANALYSIS; FOURIER SERIES; HARMONIC ANALYSIS; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); THERMOGRAPHY (TEMPERATURE MEASUREMENT);

FEM SIMULATIONS; FLOTHERM; FOURIER; HEAT DIFFUSIONS; HEAT EQUATIONS; IGBT; MATLAB/SIMULINK; MODULES; NEW MODELS; POWER DEVICES; THERMAL MODELS; THERMAL SIMULATIONS; TWO DIMENSIONS;

FINITE ELEMENT METHOD;

EID: 58049098078     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/08IAS.2008.359     Document Type: Conference Paper

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