Electrothermal simulation of multichip-modules with novel transient thermal model and time-dependent boundary conditions

IEEE Transactions on Power Electronics

Volumn 21, Issue 1, 2006, Pages 45-55

  Gerstenmaier, York C ^a,c   Castellazzi, Alberto ^b,c   Wachutka, Gerhard K M ^b  

^a SIEMENS AG   (Germany)

^b TECHNICAL UNIVERSITY OF MUNICH   (Germany)

^c IEEE   (Germany)

Author keywords

DC and ac converter for automotive; Electrothermal simulation; Multichip modules; PSpice metal oxide semiconductor field effect transistor (MOSFET) model; Thermal equivalent circuit; Time dependent boundary conditions

Indexed keywords

DC- AND AC-CONVERTER FOR AUTOMOTIVES; ELECTROTHERMAL SIMULATION; MULTICHIP-MODULES; THERMAL EQUIVALENT CIRCUITS; TIME-DEPENDENT BOUNDARY CONDITIONS;

BOUNDARY CONDITIONS; COMPUTER SIMULATION; EQUIVALENT CIRCUITS; GREEN'S FUNCTION; MATHEMATICAL MODELS; MOSFET DEVICES;

SEMICONDUCTOR DEVICES;

EID: 33947178937     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2005.861116     Document Type: Article

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