Thermal modelling of hybrid circuits: Simulation method comparison

Microelectronics Reliability

Volumn 40, Issue 3, 2000, Pages 541-546

  Janicki, M ^a   Napieralski, A ^a   Fedasyuk, D ^b   Petrov, D ^b  

^a LODZ UNIVERSITY OF TECHNOLOGY   (Poland)

^b LVIV POLYTECHNIC NATIONAL UNIVERSITY   (Ukraine)

Author keywords

[No Author keywords available]

Indexed keywords

MATHEMATICAL MODELS; TEMPERATURE DISTRIBUTION; THERMOGRAPHY (IMAGING);

THERMAL SIMULATION METHODS;

HYBRID INTEGRATED CIRCUITS;

EID: 0033903422     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(99)00240-1     Document Type: Article

References (11)

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