A novel electro-thermal simulation approach of power IGBT modules for automotive traction applications

IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD)

Volumn 16, Issue , 2004, Pages 289-292

  Kojima, Takashi ^a   Yamada, Yasushi ^a   Ciappa, Mauro ^b   Chiavarini, Marco ^b   Fichtner, Wolfgang ^b  

^a Rd Management Section   (Japan)

^b ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC IMPEDANCE; ELECTRIC POTENTIAL; HEAT RESISTANCE; MOSFET DEVICES; TRACTION (FRICTION);

ELECTRO THERMAL SIMULATION TOOLS; PARALLEL CONNECTED DEVICES; THERMAL COMPACT MODELS;

INSULATED GATE BIPOLAR TRANSISTORS;

EID: 4944221172     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/wct.2004.239990     Document Type: Conference Paper

References (3)

1. A.R. Hefner, D.L. Blackbum, "Thermal component models for electrothermal network simulation," IEEE Trans. Comp., Packg. and Manufac. Tech., vol. 17, pp. 413-424, Sep. 1994.
2. "SIMPLORER 6.0 User Manual," Ansoft Corp., 2002.
3. Chan-Su Yun, M. Ciappa, P. Malberti, W. Fichtner, "Thermal component model for electrothermal analysis of IGBT module systems," IEEE Trans. on Advanced Packaging, vol. 24, pp. 401-406, Aug. 2001.