Thermal Component Models For Electrothermal Network Simulation

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 17, Issue 3, 1994, Pages 413-424

  Hefner, Allen R ^a   Blackburn, David L ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COMPUTER SOFTWARE; ELECTRIC NETWORK ANALYSIS; ELECTRIC NETWORK SYNTHESIS; ELECTRIC NETWORK TOPOLOGY; ELECTRONICS PACKAGING; HEAT SINKS; HEAT TRANSFER; SEMICONDUCTOR DEVICES; TEMPERATURE DISTRIBUTION; TEMPERATURE MEASUREMENT;

ELECTRICAL NETWORK; ELECTROTHERMAL NETWORK SIMULATION; HEAT TRANSPORT PHYSICS; THERMAL COMPONENT MODELS;

NETWORK COMPONENTS;

EID: 0028497840     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.311751     Document Type: Article

References (12)

1. A.R. Hefner and D. L Blackburn, “Simulating the dynamic electrothermal behavior of power electronic circuits and systems,” in Conf. Rec. IEEE Workshop on Computers in Power Electronics, p. 143, 1992; also in IEEE Trans. Power Electron., vol. 8, p. 376, 1993.
2. Saber Manual, Analogy Inc.: Beaverton, OR, 1993.
3. A.R. Hefner, “A dynamic electrothermal model for the IGBT,” in Conf. Rec. IEEE Industry Applications Society Meeting, p. 1094, 1992; also in IEEE Trans. Industry Appl., vol. 30, p. 394, 1993.
4. A.R. Hefner, “Semiconductor measurement technology: INSTANT—IGBT network simulation and transient analysis tool,” NIST Special Publication 400–88, 1992.
5. J. Albers, “Semiconductor measurement technology: TXYZ: A program for semiconductor IC thermal analysis,” NIST Special Publication 400–76, 1984.
6. D.L. Blackburn, “Power MOSFET failure revisited,” in IEEE PESC Conf. Rec., p. 681, 1988.
7. G.L. Skibinski and W.A. Sethares, “Thermal parameter estimation using recursive estimation,” in IEEE IAS Conf. Rec., p. 1581, 1990.
8. G.N. Ellison, Thermal Computations for Electronic Equipment. New York: Van Nostrand Reinhold, 1984, p. 218.
9. ANSYS Engineering Analysis Systems Users Manual. Houston, PA: Swanson Analysis Systems, Inc., 1989.
10. S. Selberherr, Analysis and Simulation of Semiconductor Devices. New York: Springer, 1984.
11. F.F. Oettinger and D.L. Blackburn, “Semiconductor measurement technology: Thermal resistance measurements,” NIST Special Publication 400–86, 1990.
12. D.L. Blackburn, “A review of thermal characterization of power transistors,” in Proc. IEEE Semiconductor Thermal Measurement and Management Symp., p. 1, 1988.