Thermal component model for electrothermal analysis of IGBT module systems

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 3, 2001, Pages 401-406

  Yun, Chan Su ^a,b   Malberti, Paolo ^a,b   Ciappa, Mauro ^a,b   Fichtner, Wolfgang ^a,b  

^a IEEE   (Switzerland)

^b ETH ZURICH   (Switzerland)

Author keywords

Electrothermal simulation; Elmore delay model; Finite element method; IGBT module; Package; RC component model (RCCM); Thermal analysis; Thermal network

Indexed keywords

ELECTROTHERMAL SIMULATION; ELMORE DELAY MODEL; RC COMPONENT MODEL; THERMAL NETWORK;

COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT FLUX; HEAT RESISTANCE; HEAT SINKS; HIGH TEMPERATURE OPERATIONS; INSULATED GATE BIPOLAR TRANSISTORS; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; POWER ELECTRONICS; THREE DIMENSIONAL;

ELECTRONICS PACKAGING;

EID: 0035422779     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.938309     Document Type: Article

References (20)

1. Microelectronics cooling and semitherm: A look back
2. Thermal analysis of a chip on board (COB)
3. Issues in validating package compact thermal models for natural convection cooled electronic systems
4. Thermal analysis and modeling of a copper-polyimide thin-film-on-silicon multichip module packaging technology
5. On the representation of infinite-length distributed RC one-ports
6. Electrothermal and logi-thermal simulation of VLSI designs
7. THERMODEL: A tool for compact dynamic thermal model generation
8. Identification of RC networks by deconvolution: Chances and limits
9. Thermal monitoring and testing of electronic systems
10. Image processing procedures for the thermal measurements
11. Thermal resistance analysis by induced transient (TRAIT) method for power electronics devices thermal characterization-part I: Fundamentals and theory
12. Thermal resistance analysis by induced transient (TRAIT) method for power electronics devices thermal characterization-part II: Practice and experiments
13. Optimizing dominant time constant in RC circuits
14. The transient response of damped linear networks with particular regard to wideband amplifiers
15. Static and dynamic thermal characteristics of IGBT power modules
16. Static and dynamic thermal behavior of IGBT power modules
17. A 1200 A, 3300 V IGBT power module for traction applications