Extraction of accurate thermal compact models for fast electro-thermal simulation of IGBT modules in hybrid electric vehicles

Microelectronics Reliability

Volumn 45, Issue 9-11, 2005, Pages 1694-1699

  Ciappa, M ^a   Fichtner, W ^a   Kojima, T ^b   Yamada, Y ^b   Nishibe, Y ^b  

^a ETH ZURICH   (Switzerland)

^b Rd Management Section   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE ENGINEERING; COMPUTER SIMULATION; COSTS; ELECTRIC CONVERTERS; INSULATED GATE BIPOLAR TRANSISTORS; MATHEMATICAL MODELS; RELIABILITY;

AUTOMOTIVE APPLICATIONS; DESIGN CYCLES; ELECTRO-THERMAL SIMULATIONS; THERMAL COMPACT MODELS;

MICROELECTRONICS;

EID: 24144462863     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.07.083     Document Type: Conference Paper

References (4)

1. Oila K, Ciappa M, Seliger N, Fichtner W. Thermal Modeling, Simulation and Characterization of a High-Temperature Converter for Automotive Applications. Proc. of the 10 th Europ. Conference on Power Electronics and Applications EPE 10(2003).
2. C.-S Yun, M. Ciappa, P. Malberti, and W. Fichtner Thermal component model for electrothermal analysis of IGBT module systems IEEE Transactions on Advanced Packaging 24 2001 401 406
3. T. Kojima, Y. Yamada, M. Ciappa, M. Chiavarini, and W. Fichtner A novel electro-thermal simulation approach to power IGBT modules for automotive traction applications R&D Review of Toyota CRDL 39 2004 27 32
4. Chiavarini M. Electrothermal Modeling and Simulation of IGBT for Automotive Applications, Master thesis, ETH Zurich 2001.