-
1
-
-
80053482342
-
A dynamic electro-thermal model for the IGBT
-
A. R. Hefner: "A dynamic electro-thermal model for the IGBT", IEEE Trans. Industry Applications. Vol. 30, No. 2, pp. 394-405 (1994-3)
-
(1993)
IEEE Trans. Industry Applications
, vol.30
, Issue.2
, pp. 394-405
-
-
Hefner, A.R.1
-
2
-
-
4944221172
-
A novel eletcro-thermal simulation approach of power IGBT modules for automotive traction applications
-
T. Kojima, Y. Yamada, M. Ciappa, M. Chiavarini, and W. Fichtner: "A novel eletcro-thermal simulation approach of power IGBT modules for automotive traction applications", In ISPSD Conf. Rec., Kitakyushu (2004)
-
(2004)
ISPSD Conf. Rec., Kitakyushu
-
-
Kojima, T.1
Yamada, Y.2
Ciappa, M.3
Chiavarini, M.4
Fichtner, W.5
-
3
-
-
12544254846
-
Electromagnetic transient simulation models for accurate representation of switching losses and thermal performance in power electronic systems
-
A. D. Rajapakse, A. M. Gole, and P. L. Wilson: "Electromagnetic transient simulation models for accurate representation of switching losses and thermal performance in power electronic systems", IEEE Trans. Power Delivery, Vol. 20, No. 1, pp. 319-327 (2005-1)
-
(2001)
IEEE Trans. Power Delivery
, vol.20
, Issue.1
, pp. 319-327
-
-
Rajapakse, A.D.1
Gole, A.M.2
Wilson, P.L.3
-
4
-
-
33847740589
-
Inverter dynamic electro-thermal modeling and simulation with experimental verification
-
J. Reichl, J.-S. Lai, A. Hefner, T. McNutt, and D. Beming: "Inverter dynamic electro-thermal modeling and simulation with experimental verification", In PESC Conf. Rec, Recife (2005-6)
-
(2005)
PESC Conf. Rec, Recife
-
-
Reichl, J.1
Lai, J.-S.2
Hefner, A.3
McNutt, T.4
Beming, D.5
-
5
-
-
33947178937
-
Electrothermal simulation of multichip-module with novel transient thermal model and timedependent boundary conditions
-
Y. C. Gerstenmaier, A. Castellazzi, and G. K. M. Wachutka: "Electrothermal simulation of multichip-module with novel transient thermal model and timedependent boundary conditions", IEEE Trans. Power Electronics, Vol. 21, No. 1, pp. 45-55 (2006-1)
-
(2001)
IEEE Trans. Power Electronics
, vol.21
, Issue.1
, pp. 45-55
-
-
Gerstenmaier, Y.C.1
Castellazzi, A.2
Wachutka, G.K.M.3
-
6
-
-
34248203403
-
Exploration of power device reliability using compact thermal models and fast electro-thermal simulation
-
A. T. Bryant, P. A. Mawby, P. R. Palmer, E. Santi, and J. L. Hudgins: "Exploration of power device reliability using compact thermal models and fast electro-thermal simulation", In IAS Conf. Rec, Tampa (2006-10)
-
(2006)
IAS Conf. Rec, Tampa
-
-
Bryant, A.T.1
Mawby, P.A.2
Palmer, P.R.3
Santi, E.4
Hudgins, J.L.5
-
7
-
-
34547915611
-
The use of condition maps in the design and testing of power electronic circuits and devices
-
7
-
A. T. Bryant, N-A. Parker-Allotey, and P. R. Palmer: "The use of condition maps in the design and testing of power electronic circuits and devices", IEEE Trans. Industry Applications, Vol. 43, No. 4, pp. 874-883 (2007-7)
-
(2007)
IEEE Trans. Industry Applications
, vol.43
, Issue.4
, pp. 874-883
-
-
Bryant, A.T.1
Parker-Allotey, N.-A.2
Palmer, P.R.3
-
8
-
-
31144443023
-
A fast power loss calculation method for long real time thermal simulation of IGBT modules for a three-phase inverter system
-
Also in EPE Conf. Rec., Dresden 2005-9
-
Z. Zhou, M. S. Khanniche, P. Igic, S. T. Kong, M. Towers, and P. A. Mawby: "A fast power loss calculation method for long real time thermal simulation of IGBT modules for a three-phase inverter system", Int. J. Numerical Modelling: Electronic Networks, Devices and Fields, Vol. 19, pp. 33-46 (2006) Also in EPE Conf. Rec., Dresden (2005-9)
-
(2006)
Int. J. Numerical Modelling: Electronic Networks, Devices and Fields
, vol.19
, pp. 33-46
-
-
Zhou, Z.1
Khanniche, M.S.2
Igic, P.3
Kong, S.T.4
Towers, M.5
Mawby, P.A.6
-
9
-
-
0141787901
-
Circuit simulator models for the diode and IGBT with full temperature dependent features
-
P. R. Palmer, E. Santi, J. L. Hudgins, X. Kang, J. C. Joyce, and P. Y. Eng: "Circuit simulator models for the diode and IGBT with full temperature dependent features", IEEE Trans. Power Electronics, Vol. 18, No. 5, pp. 1220-1229 (2003-9)
-
(2003)
IEEE Trans. Power Electronics
, vol.18
, Issue.5
, pp. 1220-1229
-
-
Palmer, P.R.1
Santi, E.2
Hudgins, J.L.3
Kang, X.4
Joyce, J.C.5
Eng, P.Y.6
-
10
-
-
38349009183
-
Physical modeling of fast p-i-n diodes with carrier lifetime zoning, part I: Device model
-
A. T. Bryant, L. Lu, E. Santi, P. R. Palmer, and J. L. Hudgins: "Physical modeling of fast p-i-n diodes with carrier lifetime zoning, part I: device model", IEEE Trans. Power Electronics, Vol. 23, No. 1, pp. 189-197 (2008-1)
-
(2001)
IEEE Trans. Power Electronics
, vol.23
, Issue.1
, pp. 189-197
-
-
Bryant, A.T.1
Lu, L.2
Santi, E.3
Palmer, P.R.4
Hudgins, J.L.5
-
11
-
-
0141643281
-
Characterization and modeling of high-voltage field-stop IGBTs
-
7
-
X. Kang, A. Caiafa, E. Santi, J. L. Hudgins, and P. R. Palmer: "Characterization and modeling of high-voltage field-stop IGBTs", IEEE Trans. Industry Applications, Vol. 39, No. 4, pp. 922-928 (2003-7/8)
-
(2003)
IEEE Trans. Industry Applications
, vol.39
, Issue.4
, pp. 922-928
-
-
Kang, X.1
Caiafa, A.2
Santi, E.3
Hudgins, J.L.4
Palmer, P.R.5
-
12
-
-
34547915611
-
Simulation and optimisation of diode and IGBT interaction in a chopper cell using MATLAB and Simulink
-
7
-
A. T. Bryant, P. R. Palmer, E. Santi, and J. L. Hudgins: "Simulation and optimisation of diode and IGBT interaction in a chopper cell using MATLAB and Simulink", IEEE Trans. Industry Applications, Vol. 43, No. 4, pp. 902-910 (2007-7)
-
(2007)
IEEE Trans. Industry Applications
, vol.43
, Issue.4
, pp. 902-910
-
-
Bryant, A.T.1
Palmer, P.R.2
Santi, E.3
Hudgins, J.L.4
-
14
-
-
2942527523
-
Silicon carbide PIN and merged PIN schottky power diode models implemented in the Saber circuit simulator
-
T. R. McNutt, A. R. Hefner, H. A. Mantooth, J. Duliere, D. W. Beming, and R. Singh: "Silicon carbide PIN and merged PIN schottky power diode models implemented in the Saber circuit simulator", IEEE Trans. Power Electronics, Vol. 19, No. 3, pp. 573-581 (2004-5)
-
(2004)
IEEE Trans. Power Electronics
, vol.19
, Issue.3
, pp. 573-581
-
-
McNutt, T.R.1
Hefner, A.R.2
Mantooth, H.A.3
Duliere, J.4
Beming, D.W.5
Singh, R.6
-
15
-
-
24144462863
-
Extraction of accurate thermal compact models for fast electro-thermal simulation of IGBT modules in hybrid electric vehicles
-
M. Ciappa, W. Fichtner, T. Kojima, Y. Yamada, and Y. Nishibe: "Extraction of accurate thermal compact models for fast electro-thermal simulation of IGBT modules in hybrid electric vehicles", Microelectronics Reliability, Vol. 45, pp. 1694-1699 (2005)
-
(2005)
Microelectronics Reliability
, vol.45
, pp. 1694-1699
-
-
Ciappa, M.1
Fichtner, W.2
Kojima, T.3
Yamada, Y.4
Nishibe, Y.5
-
16
-
-
81455147299
-
A novel structure for comprehensive HEV powertrain modelling
-
A. Walker, A. McGordon, G. Hannis, A. Picarelli, J. Breddy, S. Carter, A. Vinsome, P. Jennings, M. Dempsey, and M. Willows: "A novel structure for comprehensive HEV powertrain modelling", In VPP Conf. Rec., Windsor (2006-9)
-
(2006)
VPP Conf. Rec., Windsor
-
-
Walker, A.1
McGordon, A.2
Hannis, G.3
Picarelli, A.4
Breddy, J.5
Carter, S.6
Vinsome, A.7
Jennings, P.8
Dempsey, M.9
Willows, M.10
-
17
-
-
0141866835
-
A comparative evaluation of new silicon carbide diodes and state-of-the-art silicon diodes for power electronic applications
-
A. Elasser, M. H. Kheraluwala, M. Ghezzo, R. L. Steigerwald, N. A. Evers, J. Kretchmer, and T. P. Chow: "A comparative evaluation of new silicon carbide diodes and state-of-the-art silicon diodes for power electronic applications", IEEE Trans. Industry Applications, Vol. 39, No. 4, pp. 915-921 (2003-7)
-
(2003)
IEEE Trans. Industry Applications
, vol.39
, Issue.4
, pp. 915-921
-
-
Elasser, A.1
Kheraluwala, M.H.2
Ghezzo, M.3
Steigerwald, R.L.4
Evers, N.A.5
Kretchmer, J.6
Chow, T.P.7
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