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Volumn , Issue , 2006, Pages

Novel electro-thermal coupling simulation technique for dynamic analysis of HV (hybrid vehicle) inverter

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE INDUSTRY; COMPUTER SIMULATION; ELECTRONIC EQUIPMENT; SWITCHING FREQUENCY; TEMPERATURE MEASUREMENT;

EID: 42449093681     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2006.1712076     Document Type: Conference Paper
Times cited : (21)

References (3)
  • 2
    • 42449155299 scopus 로고    scopus 로고
    • SIMPLORER 6.0 User Manual, Ansoft Corp., 2002
    • SIMPLORER 6.0 User Manual, Ansoft Corp., 2002
  • 3
    • 0035422779 scopus 로고    scopus 로고
    • Thermal Component Model for Electrothermal Analysis of IGBT Module Systems
    • C.-S. Yun, M. Ciappa, P. Malberti and W. Fichtner, "Thermal Component Model for Electrothermal Analysis of IGBT Module Systems," IEEE Trans. on Adv. Packag., 24, 2001, 401-406
    • (2001) IEEE Trans. on Adv. Packag , vol.24 , pp. 401-406
    • Yun, C.-S.1    Ciappa, M.2    Malberti, P.3    Fichtner, W.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.