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Volumn , Issue , 2006, Pages 1098-1103

Transient thermal analysis of fast switching devices by partially coupled FEM method

Author keywords

AC motor drives; Electro thermal analysis; Fast heat source changes; Finite element method; IGBT; Power device rating

Indexed keywords

ELECTRIC LOSSES; FINITE ELEMENT METHOD; HEAT LOSSES; INSULATED GATE BIPOLAR TRANSISTORS (IGBT);

EID: 39049101635     PISSN: 08407789     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CCECE.2006.277450     Document Type: Conference Paper
Times cited : (14)

References (6)
  • 1
    • 0031701170 scopus 로고    scopus 로고
    • How to extend a thermal RC-network model (derived from experimental data) to respond to an arbitrarily fast input
    • San Diego, CA
    • R. P. Stout and D. T. Billings, "How to extend a thermal RC-network model (derived from experimental data) to respond to an arbitrarily fast input," in Proc. IEEE SEMI-THERM XIV Symposium, San Diego, CA, 1998, pp. 8-15.
    • (1998) Proc. IEEE SEMI-THERM XIV Symposium , pp. 8-15
    • Stout, R.P.1    Billings, D.T.2
  • 2
    • 2442560091 scopus 로고    scopus 로고
    • Efficient Calculation of Transient Temperature Fields Responding to Fast Changing Heatsources Over Long Duration in Power Electronic Systems
    • MARCH
    • York C. Gerstenmaier and Gerhard K. M. Wachutka, "Efficient Calculation of Transient Temperature Fields Responding to Fast Changing Heatsources Over Long Duration in Power Electronic Systems" IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 27, NO. 1, pp. 104-111, MARCH 2004.
    • (2004) IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES , vol.27 , Issue.1 , pp. 104-111
    • Gerstenmaier, Y.C.1    Wachutka, G.K.M.2
  • 4
    • 0031381701 scopus 로고    scopus 로고
    • The world of thermal characterization according to DELPHIPart I: Background to DELPHI
    • Dec
    • H. Rosten, C. J. M. Lasance, and J. Parry, "The world of thermal characterization according to DELPHIPart I: Background to DELPHI," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 20, pp. 384-398, Dec. 1997.
    • (1997) IEEE Trans. Comp., Hybrids, Manufact. Technol , vol.20 , pp. 384-398
    • Rosten, H.1    Lasance, C.J.M.2    Parry, J.3
  • 5
    • 0036722931 scopus 로고    scopus 로고
    • Rigorous model and network for static thermal problems
    • Y. C. Gerstenmaier, H. Pape, and G. Wachutka, "Rigorous model and network for static thermal problems," Microelectron. J., vol. 33, pp. 711-718, 2002.
    • (2002) Microelectron. J , vol.33 , pp. 711-718
    • Gerstenmaier, Y.C.1    Pape, H.2    Wachutka, G.3
  • 6
    • 39049156906 scopus 로고    scopus 로고
    • Dynamique thermique dans les composants électroniques en commutation
    • Halifax, Nova Scotia, Canada, 7-10 May
    • Y. Hamri, A. Lakhsasi and A. Skorek, "Dynamique thermique dans les composants électroniques en commutation", Proceedings of The IEEE/CCECE 2000, Halifax, Nova Scotia , Canada, 7-10 May 2000, pp. 1128-1132.
    • (2000) Proceedings of The IEEE/CCECE , pp. 1128-1132
    • Hamri, Y.1    Lakhsasi, A.2    Skorek, A.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.