Generic methodology for deriving compact dynamic thermal models, applied to the PSGA package

IEEE transactions on components, packaging, and manufacturing technology. Part A

Volumn 21, Issue 4, 1998, Pages 565-576

  Christiaens, Filip ^a   Vandevelde, Bart ^a   Beyne, Eric ^a   Mertens, Robert ^a   Berghmans, Jan ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; CAPACITANCE; CAPACITORS; ELECTRIC NETWORK SYNTHESIS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; RESISTORS;

POLYMER STUD GRID ARRAY (PSGA) PACKAGES;

ELECTRONICS PACKAGING;

EID: 0032314440     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.740049     Document Type: Article

References (19)