Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples

Journal of Electronic Materials

Volumn 35, Issue 2, 2006, Pages 366-371

  Chang, C W ^a   Lee, Q P ^a   Ho, C E ^a   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Au Sn Cu; Cross interaction; Lead free solder

Indexed keywords

COPPER; DIFFUSION; GOLD; LEAD; SOLDERED JOINTS;

AU-SN-CU; CROSS-INTERACTION; LEAD-FREE SOLDER;

SOLDERING ALLOYS;

EID: 33644891049     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692458     Document Type: Conference Paper

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