Suitability and reliability of platinum as under-bump metallization in flip chip solder interconnections;Eignung und Zuverlaessigkeit von Platin als Unterbumpmetallisierung in Flip-Chip-Loetverbindungen

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Volumn 91, Issue 10, 2000, Pages 863-867

  Wiens, Barbara ^a,b  

^a FRAUNHOFER IZM   (Germany)

^b NONE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ENERGY DISPERSIVE SPECTROSCOPY; FOCUSING; INTERCONNECTION NETWORKS; METALLIZING; PLATINUM; SCANNING ELECTRON MICROSCOPY; SUBSTRATES;

UNDER-BUMP METALLIZATION (UBM);

FLIP CHIP DEVICES;

EID: 0034297869     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. N.N.: Mechanische Herstellung von Kontakthöckern zur Flip-Chip-Montage, FhG-Jahresbericht (1994).
2. Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Becher, K.F.; Zakel, E.; Reichl, H.: Flip Chip Interconnections to Glass Substrates Using Anisotropic Adhesives and Elektroless Nickel Bumps, Proc. Adhesives in Electronics Stockholm, (1996) 154-161.
3. Masumoto, K.: Stud Bumped Flip Chip on Flex (FOF) in Hard Drive Application, Proc. ITAP 1996, Sunnyvale, CA (1996) 59.
4. Nave, J.; Busse, E.; Zakel, E.; Reichl, H.: TC-Bonding for FC-Technology on Ceramic, Silicon and Organic Substrates, Proc. ITAP, Sunnyvale, CA. (1996) 90-98.
5. Klein, M.; Oppermann, H.; Aschenbrenner, R.; Reichl, H.: Single Chip Bumping, Proc. IMAPS 1998, San Diego, CA (1998) 659-664.
6. Ono, M.: Comparison of Stud Bump Bonding Technology and Other Flip-Chip Technologies, Proc. IMAPS, San Diego, CA (1998) 665-670.
7. Oppermann, H.; Kalicki, R.; Anhöck, S.; Kallmeyer, C.; Klein, M.; Aschenbrenner, R.; Reichl, H.: Reliability Investigations of Hard Core Solder Bumps Using Mechanical Palladium Bumps and SnPb Solder, Proc. IEMT/IMC, Sonic-City-Omiya, Tokyo (1999) 386-391.
8. Klein, M.; Wiens, B.; Hutter, M.; Oppermann, H.; Aschenbrenner, R.; Reichl, H.: Behaviour of Platinum as UBM in Flip Chip Solder Joints, Proc. ECTC 50th 2000, Las Vegas (2000) 40-45.