Reactive wetting between molten Sn-Bi and Ni substrate

Journal of Electronic Materials

Volumn 32, Issue 3, 2003, Pages 117-122

  Lee, Jou I ^a   Chen, Sinn Wen ^a   Chang, Hsiu Yu ^a   Chen, Chih Ming ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Interfacial reaction; Isothermal section; Reaction wetting; Wetting balance

Indexed keywords

BISMUTH ALLOYS; INTERFACES (MATERIALS); INTERFACIAL ENERGY; INTERMETALLICS; MOLTEN MATERIALS; NICKEL ALLOYS; SUBSTRATES; SURFACE TENSION; TERNARY SYSTEMS; TIN ALLOYS;

INTERFACIAL REACTION; INTERMETALLIC PHASE; MOLTEN TIN-BISMUTH ALLOY;

WETTING;

EID: 0037352209     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0181-4     Document Type: Article

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