Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates

Journal of Electronic Materials

Volumn 35, Issue 1, 2006, Pages 65-71

  Tsai, J Y ^a   Chang, C W ^a   Ho, C E ^a   Lin, Y L ^a   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Au Sn; Diffusion couple; Lead free solder

Indexed keywords

COMPOSITION; COPPER; EUTECTICS; GOLD COMPOUNDS; MICROSTRUCTURE; NICKEL;

AU-SN; DIFFUSION COUPLE; LAYERED MICROSTRUCTURE; LEAD-FREE SOLDER;

SOLDERING ALLOYS;

EID: 32644450179     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0185-y     Document Type: Conference Paper

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