Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy

Materials Science and Engineering: A

Volumn 242, Issue 1-2, 1998, Pages 22-25

  Kuhmann, J F ^a   Chiang, C H ^b   Harde, P ^b   Reier, F ^b   Oesterle, W ^b   Urban, I ^b   Klein, A ^b  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b NONE

Author keywords

Diffusion; FC solder bonding; Pt thin film metallization; SIMS

Indexed keywords

ACTIVATION ENERGY; ANTIMONY ALLOYS; DIFFUSION IN SOLIDS; FLIP CHIP DEVICES; INTERMETALLICS; METALLIZING; PLATINUM; SECONDARY ION MASS SPECTROMETRY; SOLDERING; THERMAL CYCLING; THERMODYNAMIC STABILITY; THIN FILMS;

SOLDER BUMP METALLURGY;

METALLIC FILMS;

EID: 0031998061     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(97)00536-4     Document Type: Article

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