Thermal-mechanical coupling analysis for coupled power and thermal cycling reliability of chip-scale packages

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 539-544

  Lai, Yi Shao ^a   Wang, Tong Hong ^a   Lee, Chang Chi ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DEFORMATION; FATIGUE OF MATERIALS; THERMAL CYCLING; THERMAL EFFECTS;

BALL GRID ARRAY; POWER CYCLING TEST; THERMAL-MECHANICAL COUPLING; THERMOMECHANICAL DEFORMATIONS; TRANSIENT TEMPERATURE;

COUPLED CIRCUITS;

EID: 33745712125     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502864     Document Type: Conference Paper

References (15)

1. JEDBC Solid State Technology Association, Power and temperature cycling, JESD22-A105C (2004).
2. Lau, J. H. and Pao, Y.-H., Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill (New York, 1997), pp. 207-209.
3. Lohan, J. and Davies, M., "Transient Thermal Behaviour of a Board-mounted 160-lead Plastic Quad Fiat Pack," Proc 1994 InterSociety Conf on Thermal Phenomena in Electr Systems, Washington DC, 1994, pp. 108-116.
4. Ham, S. J. et al, "Thermal Deformations of CSP Assembly During Temperature Cycling and Power Cycling," Proc Int Symp on Electronic Materials and Packaging, Hong Kong, China., 2000, pp. 350-357.
5. Thoben, M. et al, "Modelling and Experimental Investigations on Degradation of Microcomponents in Power Cycling," http://ansys.net/ansys/ papers/mw2000_1031.pdf, 2000.
6. Syed, A., "Predicting Solder Joint Reliability for Thermal, Power, and Bend. Cycle Within 25% Accuracy," Proc 51st Electronic Components and Technology Conf, Orlando, FL, 2001, pp. 255-263.
7. Popps, D. E. H. et al, "Flip Chip PBGA Solder Joint Reliability: Power Cycling Versus Thermal Cycling," Proc IMAPS Flip Chip 2003, Austin, TX, 2003.
8. Liu, Y. and Irving, S., "Power Cycling Simulation of an IC Package: Considering Electromigration and Thermal-mechanical Failure," Proc 53rd Electronic Components and Technology Conf, New Orleans, LA, 2003. pp. 415-421.
9. Wang, T. H. et al, "Correlation Between Power Cycling and Thermal Cycling Fatigue Reliabilities of Chip-scale Packages," Proc 29th Int Electronics Manufacturing Technology Symp, San Jose, CA, 2004, pp. 26-30.
10. Lee, C.-C. et al, "Transient Thermal Analysis of Coupled Power and Thermal Cycling Test for Electronic Packages Following JEDEC Regulations," Proc 2004 Taiwan ANSYS Conf, Nantou, Taiwan, 2004, pp. 78-82.
11. Zahn, B. A., "Impact of Ball Via Configurations on Solder Joint Reliability in Tape Based Chip-scale Packages," Proc 52nd Electronic Components and Technology Conf, San Diego, CA, 2002, pp. 1475-1483.
12. Skrzypek, J. J., Plasticity and Creep, CRC Press (Boca Raton, 1993).
13. Wilde, J. et al., "Rate Dependent Constitutive Relations Based on Anand Model for 92.5Pb5Sn2.5 Ag Solder," IEEE Trans-Adv Pack, Vol. 23, No. 3 (2000), pp.408-414.
14. Darveaux, R., "Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction," J, Electr. Pack., Trans-ASME, Vol. 124, No.3 (2002), pp.147-154.
15. Zahn, B. A. and Stout, R. P., "Evaluation of Isothermal and Isoflux Natural Convection Coefficient Correlations for Utilization in Electronic Package Level Thermal Analysis," Proc 13th Annual IEEE Semiconductor Thermal Measurement and Management Symp, Austin, TX, 1997, pp. 24-31.