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IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing
Volumn 20, Issue 3, 1997, Pages 188-193
Manufacturing concerns when soldering with gold plated component leads or circuit board pads
Author keywords

[No Author keywords available]
Indexed keywords

ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; GOLD; INTERMETALLICS; RELIABILITY; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS;
EID: 0031175648     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.649439     Document Type: Article
Times cited : (27)
References (13)
  • 1
    • 0030674867 scopus 로고    scopus 로고
    • J. Greave Evaluation of alternative surface finishes by the circuit card assembly and materials task force Proc. National Electron. Packag. Prod. Conf. 3 1559 1568 1997
    • (1997) , vol.3 , pp. 1559-1568
    • Greave, J.1
  • 2
    • 85176679726 scopus 로고
    • J. Hwang The role of gold in solder interconnections Surface Mount Technol. Dec. 1994
    • (1994)
    • Hwang, J.1
  • 3
    • 85176670832 scopus 로고
    • Electrochemical Publications U.K., Scotland
    • K. Wassink Soldering in Electronics. 1989 Electrochemical Publications U.K., Scotland
    • (1989)
    • Wassink, K.1
  • 4
    • 0026905212 scopus 로고
    • J. Glazer P. A. Kramer J. W. Morris Jr. Effect of gold on the reliability of fine pitch surface mount solder joints Circuit World 18 41 46 1992
    • (1992) , vol.18 , pp. 41-46
    • Glazer, J.1    Kramer, P.A.2    Morris Jr., J.W.3
  • 5
    • 0026912216 scopus 로고
    • E.-B. Hannech C. R. Hall Diffusion controlled reactions in Au/Pb̵Sn solder system Mater. Sci. Technol. 8 817 824 1992
    • (1992) , vol.8 , pp. 817-824
    • Hannech, E.-B.1    Hall, C.R.2
  • 6
    • 85176671506 scopus 로고
    • 3rd McGraw-Hill New York
    • H. Manko Solders and Soldering 3rd 1992 McGraw-Hill New York
    • (1992)
    • Manko, H.1
  • 7
    • 85176672552 scopus 로고
    • Van Nostrand Reinhold New York
    • H. Manko Soldering Handbook for Printed Circuits and Surface Mounting. 1986 Van Nostrand Reinhold New York
    • (1986)
    • Manko, H.1
  • 8
    • 85176688878 scopus 로고
    • E. Zakel Degradation of TAB outer lead contacts due to the Au-concentration in eutectic tin/lead solder IEEE Trans. Comp., Packag., Manufact. Technol. 17 Nov. 1994
    • (1994) , vol.17
    • Zakel, E.1
  • 9
    • 85176695054 scopus 로고
    • S. Banks Reflow soldering to gold Electron. Packag. Prod. 35 69 74 June 1995
    • (1995) , vol.35 , pp. 69-74
    • Banks, S.1
  • 10
    • 85176680711 scopus 로고
    • K. Banerji HASL free finishes Circuits Assembly 5 10 38 44 Oct. 1994
    • (1994) , vol.5 , Issue.10 , pp. 38-44
    • Banerji, K.1
  • 11
    • 85176689742 scopus 로고
    • Van Nostrand Reinhold New York
    • J. S. Hwang Solder Paste in Electronics Packaging. 1989 Van Nostrand Reinhold New York
    • (1989)
    • Hwang, J.S.1
  • 12
    • 85176691551 scopus 로고
    • F. J. Liotine Jr. Solder volume: A reliability comparison Surface Mount Technol. 29 31 Sept. 1992
    • (1992) , pp. 29-31
    • Liotine Jr., F.J.1
  • 13
    • 85176693226 scopus 로고
    • Van Nostrand Reinhold New York
    • R. P. Prasad Surface Mount Technology Principles and Practice. 1989 Van Nostrand Reinhold New York
    • (1989)
    • Prasad, R.P.1

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.