Effect of randomness of Cu-Sn intermetallic compound layer thickness on reliability of surface mount solder joints

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 2, 2000, Pages 277-284

  Huang, Wei ^a   Palusinski, Olgierd A ^a   Dietrich, Duane L ^a  

^a University of Arizona   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURVE FITTING; LEAST SQUARES APPROXIMATIONS; NORMAL DISTRIBUTION; PROBABILITY DENSITY FUNCTION; RANDOM PROCESSES; RELIABILITY; SEMICONDUCTING INTERMETALLICS; SEMICONDUCTOR DEVICE TESTING; STATISTICAL METHODS; WEIBULL DISTRIBUTION;

SURFACE MOUNT SOLDER JOINTS; THERMAL FATIGUE FAILURE;

SURFACE MOUNT TECHNOLOGY;

EID: 0033700068     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.846646     Document Type: Article

References (10)

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4. E. E. Feiton, Copper-Tin Intermetallic Joints. Troy, NY: RPI Press, 1991, pp. 88-120.
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8. P. E. Tu and Y C. Chan, "Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 20, pp. 87-93, Feb. 1997.
9. E. H. Eehman Jr., "Shapes, moments, and estimators of the Weibull distribution," IEEE Trans. Rel., vol. 12, pp. 32-38, Mar. 1963.
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