TEM sample preparation for microcompressed nanocrystalline Ni

Materials Transactions

Volumn 49, Issue 9, 2008, Pages 2091-2095

  Kuwano, Satoko ^a,b   Fujita, Takeshi ^b   Pan, Deng ^b,c   Wang, Ke ^c   Chen, Mingwei ^b,c  

^a TOHOKU GAKUIN UNIVERSITY   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

^c TOHOKU UNIVERSITY   (Japan)

Author keywords

Damaged layer; Deform; Focused ion beam; Nanocrystalline nitride; Nanoindentation; Transmission electron microscopy

Indexed keywords

ABS RESINS; ATOMIC PHYSICS; ATOMS; BEAM PLASMA INTERACTIONS; CHEMICAL FINISHING; DEFORMATION; ELECTROMAGNETIC WAVES; ELECTRON MICROSCOPES; FOCUSED ION BEAMS; ION BEAMS; ION BOMBARDMENT; IONS; MICROSCOPIC EXAMINATION; MICROSTRUCTURAL EVOLUTION; MICROSTRUCTURE; NANOCRYSTALLINE ALLOYS; NANOCRYSTALLINE MATERIALS; NANOSTRUCTURED MATERIALS; NICKEL; NICKEL ALLOYS; NITRIDES; WATER POLLUTION;

ATOMIC SCALES; COMPRESSIVE PLASTICITIES; CONVENTIONAL TECHNIQUES; DAMAGED LAYER; DEFORM; DEFORMATION MECHANISMS; LARGE DEFORMATIONS; MICROCOMPRESSION; NANOCRYSTALLINE; NANOCRYSTALLINE NICKELS; NANOCRYSTALLINE NITRIDE; NANOINDENTATION; POINT OF INTERESTS; RELIABLE; ROOM TEMPERATURES; STRAIN LEVELS; TEM OBSERVATIONS; TEM SAMPLE PREPARATIONS;

CHEMICAL POLISHING;

EID: 54549104784     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MRA2008153     Document Type: Article

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