Formation and growth of intermetallics around metallic particles in eutectic Sn-Ag solder

Journal of Electronic Materials

Volumn 32, Issue 11, 2003, Pages 1240-1248

  Lee, J G ^a   Chen, K C ^b   Subramanian, K N ^a  

^a Michigan State University   (United States)

^b CALIFORNIA POLYTECHNIC STATE UNIVERSITY   (United States)

Author keywords

Intermetallic morphology; Lead free composite solder; Metallic particle reinforcements

Indexed keywords

EUTECTICS; GROWTH (MATERIALS); LIQUID METALS; METALLIC MATRIX COMPOSITES; MORPHOLOGY; PARTICLES (PARTICULATE MATTER); SILVER; SOLDERING ALLOYS; TEMPERATURE; TIN;

LEAD FREE COMPOSITE SOLDER; METALLIC PARTICLE REINFORCEMENT; REFLOW PROCESS; TIN SILVER SOLDER;

INTERMETALLICS;

EID: 0348107244     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0018-1     Document Type: Article

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