Investigation of interfacial reactions between Sn-Ag-Bi-In solder and (Cu, electroless Ni-P/Cu) substrate

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Volumn 94, Issue 4, 2003, Pages 453-457

  Yoon, Jeong Won ^a   Lee, Chang Yong ^a   Lee, Chang Bae ^b   Yoo, Choong Sik ^b   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

Author keywords

Activation energy; Electroless Ni plating; Growth kinetics; Interfacial reaction; Intermetallic compounds; Sn Ag Bi In solder; Soldering

Indexed keywords

ACTIVATION ENERGY; DIFFUSION; ELECTROLESS PLATING; GROWTH (MATERIALS); INTERFACES (MATERIALS); INTERMETALLICS; REACTION KINETICS; SOLDERING; SUBSTRATES; TIN ALLOYS;

GROWTH RATE CONSTANTS; INTERFACIAL REACTIONS;

SOLDERING ALLOYS;

EID: 1242310831     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.030453     Document Type: Article

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