Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 5, Issue , 2005, Pages 295-298

  Nai, S M L ^a   Wei, J ^b   Gupta, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD-FREE COMPOSITE SOLDERS; NANOCOMPOSITE SOLDERS; POROSITY LEVELS; THERMOMECHANICAL ANALYSIS;

COMPACTION; EXTRUSION; NANOSTRUCTURED MATERIALS; PARTICLES (PARTICULATE MATTER); SINTERING; SYNTHESIS (CHEMICAL);

SOLDERING ALLOYS;

EID: 33645069946     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2005-79456     Document Type: Conference Paper

References (12)

1. M. Abtew, G. Selvaduray, "Lead-free Solders in Microelectronics", Materials Science and Engineering: R: Reports, vol. 27, (5-6), pp. 95-141, 2000.
2. W. Gibson, S. Choi, T. R. Bieler, K. N. Subramanian, "Environmental Concerns and Materials Issues in Manufactured Solder Joints", Proceedings of the 1997 IEEE International Symposium on Electronics and the Environment, pp. 246-251, 1997.
3. Rao R. Tummala, "Packaging trends - future drivers", Semiconductor International, June, 2003.
4. H. Mavoori, S. Jin, "Dispersion Strengthening for Dimensional Stability for Low-Melting-Point Solders", JOM, June, pp. 30-32, 2000.
5. D. C. Lin, G. X. Wang, T. S. Srivatsan, Meslet Al-Hajri, M. Petraroli, "Influence of Titanium Dioxide Nanopowder addition on Microstructural Development and Hardness of Tin-Lead Solder", Mater. Letters, vol. 57, pp. 3193-3198, 2003.
6. F. G. Yost, F. M. Hosking and D. R. Frear, in: The Mechanics of Solder Alloy Wetting and Spreading, New York: Van Nostrand Reinhold, 1993.
7. S. M. L. Nai, M. Gupta, "Synthesis of AL/SiC based functionally gradient materials using the technique of gradient slurry disintegration and deposition: effect of stirring speed", Mater. SCi. Tech., vol. 18, pp. 633-641, 2002.
8. http://www.nanoamor.com
9. http://emtoolbox.nist.gov
10. 3Sn Plate Formation in the Solidification of Near-Ternary Eutectic Sn-Ag-Cu", JOM: the journal of the Minerals, Metals & Materials Society, pp. 61-65, June 2003.
11. D. J. Lloyd, "Particle reinforced aluminium and magnesium matrix composites", International Materials Reviews, vol. 39, (1), pp. 1-23, 1994.
12. W. S. Miller and F. J. Humphreys, "Strengthening mechanisms in particulate metal matrix composites", Scripta Metallurgica et Materialia, vol. 25, pp. 33-38, 1991.