Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu-Ni-Sn layer

Scripta Materialia

Volumn 54, Issue 4 SPEC. ISS., 2006, Pages 661-664

  Hsiao, Y H ^a   Chuang, Y C ^a   Liu, C Y ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Soldering

Indexed keywords

COPPER COMPOUNDS; DISSOLUTION; ELECTROMIGRATION; NICKEL COMPOUNDS; SILICON COMPOUNDS; SOLDERING; STRESS ANALYSIS;

CU PAD DISSOLUTION; CURRENT-STRESSING; ELECTROMIGRATION-RESISTANCE;

TERNARY SYSTEMS;

EID: 28544443523     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2005.10.031     Document Type: Article

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