Electromigration and critical product in eutectic SnPb solder lines at 100°C

Journal of Applied Physics

Volumn 100, Issue 2, 2006, Pages

  Agarwal, R ^a,b   Ou, Shengquan E ^a,b   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRITICAL PRODUCT; E-SNPB; ELECTRO-MIGRATION; LATTICE DIFFUSION;

CURRENT DENSITY; EUTECTICS; MICROSTRUCTURE; SOLDERED JOINTS; SURFACE STRUCTURE; THERMAL EFFECTS;

ELECTROMIGRATION;

EID: 33746822628     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2216487     Document Type: Article

References (14)

1. K. N. Tu, J. Appl. Phys. 94, 5451 (2003).
2. K. N. Tu, J. W. Mayer, and L. C. Feldman, Electronic Thin Film Science: For electrical Engineers and Materials Scientists (Macmillan, New York, 1992).
3. C. Y. Liu, C. Chen, C. N. Liao, and K. N. Tu, Appl. Phys. Lett. 75, 58 (1999).
4. Q. T. Huynh, C. Chen, C. Y. Liu, and K. N. Tu, J. Appl. Phys. 89, 4332 (2001).
5. D. Gupta, K. Vieregge, and W. Gust, Acta Mater. 47, 5 (1998).
6. R. Agarwal and K. N. Tu, Proceedings of the 10th International Symposium on Advanced Packaging Materials, Irvine, CA, 16-18 March, 2005.
7. J. Choi, S. Lee, and Y. Joo, Jpn. J. Appl. Phys., Part 1 41, 7487 (2002).
8. W. H. Muller, Microelectron. Reliab. 44, 1901 (2004).
9. H. Ye, C. Basaran, and D. C. Hopkins, Int. J. Solids Struct. 41, 2743 (2004).
10. T. Y. Lee, K. N. Tu, S. M. Kuo, and D. R. Frear, J. Appl. Phys. 89, 3189 (2001).
11. Y. T. Yeh, C. K. Chou, Y. C. Hsu, and Chih Chen, Appl. Phys. Lett. 86, 20 (2005).
12. H. Gan and K. N. Tu, J. Appl. Phys. 97, 063514 (2005).
13. I. A. Blech, J. Appl. Phys. 47, 1203 (1976).
14. I. A. Blech and C. Herring, Appl. Phys. Lett. 29, 131 (1976).