Rapid detailed temperature estimation for highly coupled IC interconnect

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volumn 27, Issue 10, 2008, Pages 1840-1851

  Labun, Andrew ^a,b   Jagjitkumar, Karan ^b  

^a IEEE

^b UNIVERSITY OF BRITISH COLUMBIA   (Canada)

Author keywords

Electromigration reliability (EMR); Interconnect temperature; Thermal model

Indexed keywords

METALLIZING;

ANALYTICAL SOLUTIONS; ELECTROMIGRATION RELIABILITY; ELECTROMIGRATION RELIABILITY (EMR); HEAT EQUATIONS; IC INTERCONNECT; INTERCONNECT TEMPERATURE; JOULE SELF-HEATING; NETWORK EQUATIONS; STEADY-STATE TEMPERATURE; TEMPERATURE ESTIMATIONS; THERMAL MODEL;

OPTICAL INTERCONNECTS;

EID: 52649083742     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAD.2008.2003275     Document Type: Article

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