iTEM: A chip-level electromigration reliability diagnosis tool using electrothermal timing simulation

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1996, Pages 172-179

  Teng, Chin Chi ^a   Cheng, Yi Kan ^a   Rosenbaum, Elyse ^a   Kang, Sung Mo ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC WIRING; ELECTROMIGRATION; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; RELIABILITY; VLSI CIRCUITS;

CHIP LEVEL ELECTROMIGRATION RELIABILITY DIAGNOSIS TOOL; ELECTROTHERMAL TIMING SIMULATION; INTERCONNECT TEMPERATURE;

CMOS INTEGRATED CIRCUITS;

EID: 0029721320     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)