Predicting thermal behavior of interconnects

International Integrated Reliability Workshop Final Report

Volumn , Issue , 1999, Pages 54-60

  Gill, J ^a   Harmon, D ^a   Furukawa, J ^a   Sullivan, T ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTRIC INSULATING MATERIALS; ELECTRIC NETWORK ANALYSIS; FINITE ELEMENT METHOD; HEATING; MATHEMATICAL MODELS; SILICON WAFERS; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EFFECTS; THERMOANALYSIS;

EMBEDDED INTERCONNECTS;

INTERCONNECTION NETWORKS;

EID: 0033282166     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)