Closed-form Analytical Thermal Model for Accurate Temperature Estimation of Multilevel ULSI Interconnects

IEEE Symposium on VLSI Circuits, Digest of Technical Papers

Volumn , Issue , 2003, Pages 275-278

  Chiang, Ting Yen ^a   Saraswat, Krishna C ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT LOSSES; MICROPROCESSOR CHIPS;

CHIP DESIGN;

ULSI CIRCUITS;

EID: 0141761373     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. W. R. Hunter, Tech. Dig. IEDM, 1995, pp.483-486.
2. T. Y. Chiang et al., Tech. Dig. IEDM, 2001, pp. 681-684.
3. T. Y. Chiang et al., VLSI Tech. Symp. Kyoto, Japan, June 2001, pp. 141.
4. T.Y. Chiang et al., ICCAD, 2001, pp 165-172.
5. F.P. Incropera and D. P. DeWitt, Fundamentals of heat and mass transfer. New York: John Wiley & Sons, 1996, pp. 110-134.
6. The International Technology Roadmap for Semiconductors, 2001.