CLIMATE (chip-level intertwined metal and active temperature estimator)

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD

Volumn 2003-January, Issue , 2003, Pages 23-26

  Labun, A ^a,b   Reeve, T ^c  

^a HEWLETT PACKARD COMPANY   (United States)

^b INTEL CORPORATION   (United States)

^c Electric Boat Corporation   (United States)

Author keywords

Coupling circuits; Electromigration; Integrated circuit interconnections; Risk management; Steady state; Temperature dependence; Temperature sensors; Timing; Ultra large scale integration; Wire

Indexed keywords

COUPLED CIRCUITS; ELECTROMIGRATION; FINITE ELEMENT METHOD; RISK ASSESSMENT; RISK MANAGEMENT; SEMICONDUCTOR DEVICES; TEMPERATURE DISTRIBUTION; TEMPERATURE SENSORS; TIMING CIRCUITS; ULSI CIRCUITS; WIRE;

3D FINITE ELEMENT MODEL; EXPONENTIAL DEPENDENCE; GEOMETRIC PROCESSING; INTEGRATED CIRCUIT INTERCONNECTIONS; STEADY STATE; TEMPERATURE DEPENDENCE; TEMPERATURE-DEPENDENT RESISTANCE; TIMING;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 52649148851     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SISPAD.2003.1233628     Document Type: Conference Paper

References (7)

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2. D. Harmon, J. Gill, and T. Sullivan, "Thermal Conductance of IC Interconnects Embedded in Dielectrics," Integrated Reliability Workshop Final Report, 1-9, 1998.
3. Narain D. Arora, Kartik V. Raol, Reinhard Schumann, and Llanda M. Richardson, "Modeling and Extraction of Interconnect Capacitances for Multilayer VLSI Circuits," IEEE Trans. Computer-Aided Design, vol. CAD-15, pp. 58-67, 1996.
4. Chin-Chi Teng, Yi-Kan Cheng, Elyse Rosenbaum, and Sun-Mo Kang, "iTEM: A Chip-Level Electromigration Reliability Diagnosis Tool Using Electrothermal Timing Simulation," International Reliability Physics Symposium, 172-179, 1996.
5. Andrew Labun and James Jensen, "One-Dimensional Estimation of Interconnect Temperatures," International Integrated Reliability Workshop Final Report, 157-161, 2002.
6. Rainer Sabelka, Kazuhide Koyama, and Siegfried Selberherr, "STAP - A finite element simulator for three-dimensional thermal analysis of interconnect structures," Proc. Simulation in Industry - 9th European Simulation Symposium, 621-625, 1997.
7. STAP reports minimum and maximum temperatures on each segment but not trajectories. The graph shows linear interpolations between these extrema, which are assigned to opposite ends of their respective segments.