Modeling and analysis of via hot spots and implications for ULSI interconnect reliability

IEEE International Reliability Physics Symposium Proceedings

Volumn 2002-January, Issue , 2002, Pages 336-345

  Im, Sungjun ^a   Banerjee, K ^a   Goodson, K E ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

Analytical models; Boundary conditions; Dielectrics; Finite element methods; Geometry; Power system interconnection; Solid modeling; Temperature; Thermal conductivity; Ultra large scale integration

Indexed keywords

ANALYTICAL MODELS; BOUNDARY CONDITIONS; DIELECTRIC MATERIALS; GEOMETRY; RELIABILITY; RELIABILITY ANALYSIS; TEMPERATURE; THERMAL CONDUCTIVITY; ULSI CIRCUITS;

FINITE ELEMENT SIMULATIONS; HOTSPOT TEMPERATURE; INTERCONNECT RELIABILITY; INTERCONNECT STRUCTURES; INTERCONNECT SYSTEMS; POWER SYSTEM INTERCONNECTION; SOLID MODEL; TEMPERATURE PROFILES;

FINITE ELEMENT METHOD;

EID: 84949219298     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2002.996657     Document Type: Conference Paper

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