One-dimensional estimation of interconnect temperatures

IEEE International Integrated Reliability Workshop Final Report

Volumn 2002-January, Issue , 2002, Pages 155-158

  Labun, Andrew ^a   Jensen, James ^b  

^a Hewlet1 Packard Caprdtiofl   (United States)

^b Intel Carparation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; HEATING TEMPERATURE; INTEGRATED CIRCUIT INTERCONNECTS; ONE DIMENSIONAL; SILICA;

3D FINITE ELEMENT MODEL; COMPUTATIONAL RESOURCES; ELECTROMIGRATION RELIABILITY; HEAT EQUATION; HEATING TEMPERATURES; INTERCONNECT NETWORKS; ONE-DIMENSIONAL; SELF-HEATING; TEMPERATURE TRAJECTORY; ULSI INTERCONNECTS;

LOW-K DIELECTRIC;

EID: 52649101711     PISSN: 19308841     EISSN: 23748036     Source Type: Conference Proceeding    
DOI: 10.1109/IRWS.2002.1194256     Document Type: Conference Paper

References (6)

1. Product Information for SiLK™ H semiconductor dielectric, Dow Chemical Company, January 2000.
2. J. R. Black, "Electromigration Failure Modes in Aluminum Metallization for Semiconductor Devices," Proc. of the IEEE, 57, No. 9, 1587-1593, 1969.
3. D. Harmon, J. Gill, and T. Sullivan, "Thermal Conductance of IC Interconnects Embedded in Dielectrics," Integrated Reliability Workshop Final Report, 1-9, 1998.
4. Chin-Chi TEng, Yi-Kan Cheng, Elyse Rosenbaum, and Sun-Mo Kang,"iTEM: A Chip-Level Electromigration Reliability Diag-nosis Tool Using Electrothermal Timing Simulation," International Reliability Physics Symposium, 172-179, 1996.
5. The software is an evolution of that described by Dale R. Donchin, Timothy C. Fischer, Thomas F. Fox, Victor Peng, Ronald P. Preston, and William R. Wheeler, "The NVAX CPU Chip: Design Challenges, Methods, and CAD Tools," Digital Technical Journal 4, No. 3, 1992.
6. Rainer Sabelka, Kazuhide Koyama, and Siegfried Selberherr, "STAP - A finite element simulator for three-dimensional thermal analysis of interconnect structures," Proc. Simulation in Industry - 9th European Simulation Symposium, 621-625, Oct. 1997.